| PART |
Description |
Maker |
| FS1024 |
I.C. Socket, Pin Grid Array
From old datasheet system
|
Advanced Interconnections
|
| 546-93-108-12-101-035 546-93-108-12-101-036 |
Pin Grid Array sockets Press-fit terminations
|
Precid-Dip Durtal SA
|
| 4D470 |
PIN Array(Parallel Datacom, Telecom)
PIN Array(Parallel Datacom/ Telecom)
61 High-Freq Split Round Cable Suppression Core RoHS Compliant: Yes
|
Mitel Semiconductor
MITEL[Mitel Networks Corporation]
|
| HPQ-09W HPQ-06 HPQ-10 HPQ-10W HPQ-04 HPQ-07 HPQ-08 |
POWER SPLITTERS/COMBINERS 690 MHz - 830 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 510 MHz - 570 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 900 MHz - 970 MHz RF/MICROWAVE COMBINER, 0.45 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 880 MHz - 1030 MHz RF/MICROWAVE COMBINER, 0.5 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 730 MHz - 800 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 315 MHz - 395 MHz RF/MICROWAVE COMBINER, 0.45 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 580 MHz - 690 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 680 MHz - 790 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 480 MHz - 600 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 380 MHz - 490 MHz RF/MICROWAVE COMBINER, 0.4 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 410 MHz - 455 MHz RF/MICROWAVE COMBINER, 0.35 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 1700 MHz - 2400 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.71 dB INSERTION LOSS
POWER SPLITTERS/COMBINERS 990 MHz - 1100 MHz RF/MICROWAVE COMBINER, 0.45 dB INSERTION LOSS
|
Mini-Circuits
|
| Z1002-00 |
Track Pin Insertion Tool
|
Harwin Plc
|
| JCPS-8-850-75 |
10 MHz - 850 MHz RF/MICROWAVE COMBINER, 3 dB INSERTION LOSS ROHS COMPLIANT, METAL, CASE BG291, 14 PIN
10 MHz - 850 MHz RF/MICROWAVE COMBINER, 3 dB INSERTION LOSS CASE BG291, 14 PIN
|
Mini-Circuits
|
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| 70287-1088 |
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 82 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0702871038 |
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 80 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
